About MoldMan Systems™

The founders of MoldMan realized early on that there was a strong need for an alternative to potting of electronics. Low Pressure Injection Molding was already a trusted replacement for potting in Europe. It was soon realized that better and more efficient equipment, was needed for this emerging LPM electronic encapsulation process.

In 1998 the most efficient and user friendly equipment was then developed. The engineers at MoldMan performed in-depth studies to fully understand how to process the adhesive Polyamide materials. The results of this study gave them the foundation to develop the best possible Low Pressure Injection Molding machines in the market. As a testimony to the quality and efficiency of our Mold Man® Machines, patents are held Globally.

The knowledge that was gained on processing adhesive molding materials is also used to support our customers. We can help and support you to develop the best and most unique solutions for any given application.

Moldman Systems

4649 Aircenter Circle, Ste. 101
Reno, NV 89502, USA
Telephone: 775-332-1600
Fax: 775-332-1601

USA

contactus@moldmansystems.com

Australia

info@ellsworth.com.au
+61 8 8321 9346

China

info@ellsworth.com.hk
moldmansystems.com.cn
Shenzhen +86 755 25190059
Shanghai +86 21 50589388
Hongkong +852 2805 8333

India

info@ellsworth.in
New Dehli +91 011 45566223-5

Indonesia

info@ellsworth.com.hk
+62 811 6000 754

Malaysia

info@ellsworth.com.my
+6 03 5122 4332

Thailand

info@ellsworth.co.th
+66 2645 2820

Vietnam

info@ellsworth.com.vn
+84 8 3926 0681

United Kingdom / Europe

contactus@moldmansystems.com