MoldMan Systems™ Low Pressure Molding Materials

Mold Man® Hot-Melt Low Pressure Molding Systems and Melt on Demand Molding™ Systems are designed to work with select hot-melt materials like polyamides, copolyesters and Polyamide-Acrylic Hybrids. Some of the main differences between polyamides and copolyesters are hardness, elasticity, and chemical resistance. Polyamide-Acrylic Hybrids are available in clear, with additional resistance to abrasion.

Mold Man® Mix on Demand Molding™ Systems are designed to work with select materials like single and 2k silicones, offering offer a completely new range of protection.

Polyamides

Polyamides are harder and more rigid than copolyesters, provide excellent protection against dust, moisture, strain, vibration and impact. Polyamids are used in automotive, industrial electronics, and personal electronics industries regularly. The rigidity and abrasion resistance of Polyamides make them a desirable material for molded-on strain relief for cables and connectors, and integrated housing for electronics and PCBs. Polyamides, with a viscosity between 2000 and 7000 cPs and flow very easily around large and small parts without requiring a pressurized Nitrogen reservoir.

Polyamide-Acrylic Hybrids

Polyamide-Acrylic Hybrids are available in a clear material, ideal for LED light pipes and applications where transparency is desired, such as LCD screens, windows, and design aesthetics. Polyamide-Acrylic Hybrids, with a higher Shore-A, offer a higher wear resistance than polyamides. Polyamide-Acrylic Hybrids are well suited for all Mold Man® Hot Melt Machines like the Mold Man® 8000, Mold Man® 8200, Mold Man® 6000, Mold Man® 6200, and the new Mold Man® 1050 Melt on Demand Molding™ table top machine.

Copolyesters

Copolyesters are softer and more resistant to solvents than polyamides. Their resistance to solvents such as gasoline, diesel fuel and alcohol, make copolyesters ideal for automotive and medical applications. Copolyesters, being a soft and elastic material, are often used for molded on gaskets and anything that requires memory. Copolyesters have a high viscosity, between 10000 and 35000 cPs and are well suited for our Melt on Demand Molding™ systems with pressurized Nitrogen reservoir, integrated into the Mold Man® 1050, and as an option for the Mold Man® 8200.

Polyolefins

Polyolefins are a chemically resistant material that has good bond strength to polyolefin wire jackets and circuit boards. The material, often a blend of polyethylene and polypropylene provide excellent protection against dust, moisture, strain, vibration and impact, while remaining dry (hydrophobic) and maintaining solvent and acid resistance. Polyolefins are used in automotive, industrial electronics, and personal electronics industries regularly. Polyolefins vary in viscosity, but a have nominal viscosity between 2000 and 7000 cPs and flow very easily around large and small parts without requiring a pressurized Nitrogen reservoir.Polyolefins are well suited for all Mold Man® Hot Melt Machines like the Mold Man® 8000Mold Man® 8200Mold Man® 6000Mold Man® 6200, and the new Mold Man® 1050 Melt on Demand Molding™ table top machine.

Silicones

Silicones are softer than copolyesters and more resistant to solvents than polyamides. Silicones, being a soft and elastic material, are often used for molded on gaskets and anything that requires memory. Silicones are available in a clear material, ideal for LED light pipes and applications where transparency is desired, such as LCD screens, windows, and design aesthetics. Silicones are ideal for overmolding electronics as well as molding stand alone products, even optics. Silicones have a very high viscosity, between 9000 and 446,500 cPs and are formulated for our Mix on Demand Molding™ systems like the new Mold Man® 2050 Mix on Demand Molding™ table top machine.


elemelt™

MoldMan Systems™ offers its own line of low pressure molding materials under the brand name elemelt™, available in polyamides and copolyesters. Our polyamides are currently available in black and amber, while copolyesters are currently available in black, white and amber. Contact Mold Man Systems for information and to order elemelt low pressure molding materials using the Materials Inquiry form.

Visit the comprehensive  Let’s talk Business form to begin a more comprehensive discussion regarding the use of elemelt materials and Mold Man® Machines for your low pressure molding application.


silset™

MoldMan Systems has its own line of silicones under the name silset™. Designed for use in low pressure molding applications, silset™ silicones provide an alternative to polyamides and copolyesters where solvent resistance, flexibility, elasticity, protection against temperature, and memory retention are required. Contact MoldMan Systems for information and to order elemelt low pressure molding materials using the Materials Inquiry form.

Visit the comprehensive  Let’s talk Business form to begin a more comprehensive discussion regarding the use of silset materials and Mold Man® Machines for your low pressure molding application.


Technomelt
Henkel

Henkel® offers polyamide low pressure molding materials for use in Mold Man® Machines under the brand name Technomelt®, available in black, white, amber. Technomelt  also offers a Polyamide-Acrylic Hybrid low pressure molding material available in clear. Contact MoldMan Systems for information and to order Technomelt low pressure molding materials using the Materials Inquiry form.

Visit the comprehensive  Let’s talk Business form to begin a more comprehensive discussion regarding the use of Technomelt materials and Mold Man® Machines for your low pressure molding application.


Materials Inquiry