Technomelt®

Mold Man® Systems are compatible with a branded adhesive thermoplastic polyamide called Technomelt®, developed by the Henkel® Corporation, that has been used to over-mold electronics for over twenty years. Contact MoldMan Systems for information and to order Technomelt® low pressure molding materials using the Materials Inquiry form.

Visit the comprehensive  Let’s talk Business form to begin a more comprehensive discussion regarding the use of Technomelt® materials and Mold Man® Machines for your low pressure molding application.

Technomelt® Polyamide Material Data Sheet : General Reference*

Material

OM 633 / OM 638OM 641 / OM 646OM 652 / OM 657OM 673 / OM 678MM 6208 / MM 6208S
ColorAmber / BlackAmber / BlackAmber / BlackAmber / BlackAmber / Black
Physical
Specific gravity, S.G.0.980.980.980.980.98
Working Temperature, °C-40 to +125-40 to +125-40 to +120-40 to +140-40 to +130
Elongation @ rupture, %400800400400600
Hardness shore A9092778878
Hardness @ 125°C, shore AN/AN/AN/AN/AN/A
Softening point, ball & ring, °C175 ±5175 ±5161 ±4187 ±5155 ±5
Glass transition temperature, °C-36-35-45-50-42
Molding temperature, °C200 to 240210 to 240200 to 240210 to 240190 to 230
Viscosity @ 210°C, mPa-s (cP)3,5004,5004,0003,4003,600
Electrical
Dielectric constant @ 1kHz4.5 / 4.75.1 / 5.56.2 / 6.34.9 / 4.96.1 / 6.3
Volume resistivity, Ohm cm1.7E15 / 2.4E136.3E12 / 1.7E121.0E12 / 7.2E111.90E12 / 1.90E121.9E11 / 1.6E11
Dielectric strength, kV / mm24 / 1925 / 2214 / 1520 / 2023 / 23
Rating
FDA category, adhesives175.105 (0M633)175.105 (0M641)175.105 (0M652)175.105 (0M673)175.105 (0M6208)
Flammability ratingUL94 V-0UL94 V-0UL94 V-0UL94 V-0UL94 V-0

*Technomelt Technical Data Sheet general references are provided as a reference only, and MoldMan™ Systems is not responsible for accuracy. Henkel Technomelt® materials up to date Information can be obtained directly from Henkel.