elemelt™ low pressure molding materials SP92-180-A

elemelt™ : SP-92-180-A : Amber

MoldMan Systems™ has developed its own line of polyamides called elemelt™. Designed for use in general low pressure molding applications, elemelt™ provides a low cost alternative where specialty polyamides are not required.

SKU: SP-92-180-A Categories: , ,

Product Description

Elemelt SP92-180-A is a high molecular weight polyamide resin designed for low pressure molding. This resin has the characteristics of a short open time with a high softening point and excellent adhesion to multiple substrates. Application temperature is 210-230°C which is ideal for PCB encapsulation and durability. Adhesion can be improved with plasma treating or by using chemical primer. This product is available in both amber and black.

TDS-Elemelt-SP92-180-A [pdf]

MSDS-SP92-180-A [pdf]

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