elemelt™ : SP-92-180-B : Black
MoldMan Systems™ has its own line of polyamides under the name elemelt™. Designed for use in general low pressure molding applications, elemelt™ polyamides provide a low cost alternative where specialty polyamides are not required.
Elemelt SP92-180-B is a high molecular weight polyamide resin designed for low pressure molding. This resin has the characteristics of a short open time with a high softening point and excellent adhesion to multiple substrates. Application temperature is 210-230°C which is ideal for PCB encapsulation and durability. Adhesion can be improved with plasma treating or by using chemical primer. This product is also available in amber.
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