elemelt™ low pressure molding materials SP79-160-B

elemelt™ : SP79-160-B : Black

MoldMan Systems™ has its own line of polyamides under the name elemelt™. Designed for use in general low pressure molding applications, elemelt™ polyamides provide a low cost alternative where specialty polyamides are not required.

SKU: SP79-160-B Categories: , ,

Product Description

elemelt™ SP79-160-B is a high molecular weight polyamide resin designed for low pressure molding. This resin has the characteristics of a high softening point and excellent adhesion to multiple substrates. Application temperature is 180-200°C which is ideal for PCB encapsulation eliminating solder reflow issues. Adhesion can be improved with plasma treating or by using chemical primer. This product is also available in amber.

TDS-Elemelt-SP79-160-B [pdf]

MSDS-SP79-160-B [pdf]

Mold-Man™ 1050

Mold-Man™ 6000

Mold-Man™ 6200

Mold-Man™ 8000

Mold-Man™ 8200

Get Pricing

Please select the materials you are interested in receiving pricing on. A MoldMan Systems representative will contact you based on the provided information.