elemelt™ low pressure molding materials TC-960-0R02-B

elemelt™ : TC-960-0R02-B : Black

MoldMan Systems™ has its own line of copolyesters under the name elemelt™. Designed for use in low pressure molding applications, elemelt™ copolyesters provide an alternative to polyamides where solvent resistance, high adhesion, elasticity and memory retention are required.

SKU: TC-960-0R02-B Categories: , ,

Product Description

TC-960-0R02-B is a high molecular weight copolyester designed for low pressure molding. This resin has the characteristics of a short open time with a high melting point. Application temperature is 180-210°C which is ideal for PCB encapsulation and durability. Adhesion can be improved with plasma treating or by coating chemical primer. This product is available in black.

TDS-Elemelt-TC-960-0R02-B [pdf]

Mold-Man™ 1050

Mold-Man™ 8200*

*Copolyester materials require our optional melt on demand system with pressurized Nitrogen reservoir when used with Mold-Man™ 8200 Machines.

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