elemelt™ : TC-960-0R02-B : Black
TC-960-0R02-B is a high molecular weight copolyester designed for low pressure molding. This resin has the characteristics of a short open time with a high melting point. Application temperature is 180-210°C which is ideal for PCB encapsulation and durability. Adhesion can be improved with plasma treating or by coating chemical primer. This product is available in black.
*Copolyester materials require our optional melt on demand system with pressurized Nitrogen reservoir when used with Mold-Man™ 8200 Machines.
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