elemelt™ : TC-960-RK30-B : Black
TC-960-RK30 is a high molecular weight copolyester resin designed for low pressure molding with good adhesion. This resin has the characteristics of a short open time with a high melting point. Application temperature is 180-210℃ which is ideal for PCB encapsulation and durability. This product is available in black.
*Copolyester materials require our optional melt on demand system with pressurized Nitrogen reservoir when used with Mold Man® 8200 Machines.
Please select the materials you are interested in receiving pricing on. A MoldMan Systems representative will contact you based on the provided information.