elemelt™ low pressure molding materials TC-968-0000-W

elemelt™ : TC-968-0000-W : White

MoldMan Systems™ has its own line of copolyesters under the name elemelt™. Designed for use in low pressure molding applications, elemelt™ copolyesters provide an alternative to polyamides where solvent resistance, high adhesion, elasticity and memory retention are required.

SKU: TC-968-0000-W Categories: , ,

Product Description

TC-968-0000-W is a high molecular weight copolyester designed for low pressure molding. This resin has the characteristics of a short open time with a high melting point. Application temperature is 180-210°C which is ideal for PCB encapsulation and durability. Adhesion can be improved with plasma treating or by coating chemical primer. This product is available in white.

TDS-Elemelt-TC-968-0000-W [pdf]

Mold Man® 1050

Mold Man® 8200*

*Copolyester materials require our optional melt on demand system with pressurized Nitrogen reservoir when used with Mold Man® 8200 Machines.

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