Technomelt® : OM6208S : Black
Mold-Man™ Systems are compatible with a branded adhesive thermoplastic polyamide called Technomelt®, developed by the Henkel® Corporation, that has been used to over-mold electronics for over twenty years.
MM6208S high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. MM6208S exhibits great flexibility in applications requiring strain relief and is ideal for encapsulation of heat-producing components.
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