Technomelt® : OM673 : Amber
Mold-Man™ Systems are compatible with a branded adhesive thermoplastic polyamide called Technomelt®, developed by the Henkel® Corporation, that has been used to over-mold electronics for over twenty years.
OM673 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. OM673 can be used in automotive underhood applications where high service temperature performance is critical.
Please select the materials you are interested in receiving pricing on. A MoldMan Systems representative will contact you based on the provided information.