Technomelt® : PA-668 : White

Mold-Man™ Systems are compatible with a branded adhesive thermoplastic polyamide called Technomelt®, developed by the Henkel® Corporation, that has been used to over-mold electronics for over twenty years.

SKU: PA-668 Categories: , ,

Product Description

PA 668 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. PA 668 is particularly suited to applications such as computer connectors and memory sticks where high strength and hardness are desired.

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Mold-Man™ 8000

Mold-Man™ 8200

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