Traditional Hot-Melt Low-Pressure Molding & then something completely new.
MoldMan Systems now has several one-step process to encapsulate, seal and protect cables and electronics, replacing cumbersome potting operations. Hot-Melt Low-Pressure Molding provides freedom to design unique products using high performance adhesive materials and yielding final products in seconds. This technology is available in the following Mold Man® Machines: Mold Man® 6000, Mold Man® 6200, Mold Man® 8000, Mold Man® 8200.
MoldMan Systems now offers our original Hot-Melt adhesive molding machines as well as our new Melt on Demand Molding™ machines, and the newest industry changer, Mix on Demand Molding™ for single and 2k silicone materials.
Melt on Demand Molding™
MoldMan Systems has developed patent pending technology for hot melt adhesive molding materials such as polyamides, polyamide-acrylic hybrids, and copolyesters to melt at the ideal time, right before the injection nozzle. This new method reduces material char and degradation, with exact metering of shot size. This technology is available in the Mold Man® 1050 table top machine, and as an option for the Mold Man® 8200.
Melt on Demand Molding™ is ideal for sealing electronics and PCBs and creating molded on strain reliefs.
Mix on Demand Molding™
MoldMan Systems has developed patent pending technology for single and 2k materials such as silicones, to mix material parts at the ideal time, right at the injection nozzle. This new method reduces material waste, allowing materials to remain unmixed and thereby removing idle setting time, with exact metering of shot size. This technology is available in the new Mold Man® 2050 table top machine.
Mix on Demand Molding™ is ideal for encapsulating and sealing electronics and PCBs as well as producing stand-alone products, even silicone optics.